Electronics Forum | Fri Sep 15 10:14:02 EDT 2000 | aflewelling
We regularly add entries to the industry directory for companies and societies and associations that we think would be of interest to the SMTnet community. We invite a contact there to come and "claim" the mini-page. In the instance or instances yo
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Fri Jul 21 12:28:02 EDT 2000 | Barbara Keating
MVT has never been in as strong position as they are today. Over the past two weeks alone, MVT has opened two new offices in Mexico and Singapore, launched new products and closed more sales than any other previous period. MVT's AOI solutions are rap
Electronics Forum | Mon May 08 16:01:11 EDT 2000 | John
I was running the conveyor at 3.75 when we started the discussion with Electrovert. Unfortunately, foam fluxing is a fact of life for us. Our products have open contact relays that can become contaminated by spray fluxing. Titration is our only me
Electronics Forum | Thu Apr 27 15:26:02 EDT 2000 | D Scott
Ron, I too use a Nicolet NXR 1400i. By using the rotation fixture and offsetting the board, a good BGA solder joint will appear elongated. If you rotate the board away from you the wetted joint will appear to lighten and become flat (looking at the
Electronics Forum | Wed Apr 12 21:43:56 EDT 2000 | Micah Newcomb
Is this board going across wave? If not, you are pretty safe to lose the glue process. If it does go across wave you can probably lose the solderpaste and replace your solder stencil with a glue stencil, much faster and efficient than dispensing.
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca
Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Wed Jan 17 21:05:47 EST 2001 | davef
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