Electronics Forum | Fri Jan 19 12:17:57 EST 2001 | slthomas
Thanks Dave. Talked to a few people at APEX this week and if nothing else, had my frustration reduced some. Of course I made sure I talked to mfg. people and avoided the design guys like the plague. ;) I actually picked up a copy of 785 a while bac
Electronics Forum | Wed Dec 20 21:01:12 EST 2000 | Dave F
Talk about glam jobs � About once a month, we�d go over to the slaughter yard to get cows� teeth for Dr. Mueller. Then we�d fixture them on their side and run them in a machine that scrubbed them with a brush for weeks. The cool thing about cows te
Electronics Forum | Fri Dec 15 09:48:25 EST 2000 | CAL
WOW!! I about coughed my false teeth when I read your posting. KUDOS to you Dave. You are right empfasis is great because it is a technical publication written by Engineers and Scientist for Engineers and Scientists.Since you opened this can of worms
Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman
I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Tue Jun 13 21:07:54 EDT 2000 | Keith Luke
Cunli, Thanks for the feedback on OnBoard. We will be introducing the new OnBoard Forum component page next week. There you will be able to quickly access archived OnBoard Forums, and see our schedule of upcoming events. We are still weighing w
Electronics Forum | Fri Feb 25 04:46:36 EST 2000 | Jeff Sanchez
Hey Travis, Thanks for the response. I did find a simple profile to use. As you said it took alot of trial and error. I was just looking for a good place to start. As for questioning the capability of a batch reflow oven,they have good reviews f
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