Electronics Forum | Fri Sep 07 09:55:19 EDT 2007 | russ
what type of solder paste are you using? Why the concern over wetting spread to the edge of pads? Are the solderjoints formed correctly at the component? Russ
Electronics Forum | Fri Sep 26 01:15:05 EDT 2008 | scauter
Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what has happened to this? The PCB surface finsihing is OSP with regular lead-free 305/405 solder paste. Thanks SC
Electronics Forum | Sun Oct 19 08:11:12 EDT 2008 | davef
While you're waiting for others to reply to your question on component analysis laboratories, search the fine SMTnet Archives to find posts like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35636
Electronics Forum | Tue Oct 21 10:57:15 EDT 2008 | arosario
Hi Dave, thanks for the info. I'll check the detail and try to send sample SMD's for test. - Bong
Electronics Forum | Tue Oct 21 11:19:30 EDT 2008 | ljohnson
Sounds to me like your printer not releasing paste now and again. How can you be sure that you are not getting print skips. Are you using any kind on AOI?
Electronics Forum | Thu May 28 22:17:18 EDT 2009 | davef
If your fabricator understands and controls their in-house ENIG, you should be OK. It seems that fabs don't undererstand ENIG processes well enough to duplicate hyper-corroded nickel, but those that have not seen the defect usually never see it.
Electronics Forum | Fri May 29 02:05:34 EDT 2009 | nibirta
So true :) But I think we will have the final fight with the supplier when we will have troubles with the ENIG. We will assembly the product. From my experience, i never found a product with no black pad defects. It depends of the fabrication lots. T
Electronics Forum | Wed Jun 03 01:59:41 EDT 2009 | nibirta
Thank you all for these helpfull informations. I knew that I always can have the right support from you :) Tks again. Nico
Electronics Forum | Wed Jun 03 11:04:32 EDT 2009 | joeherz
Another thing to consider - If you're processing lead free, the nickel layer between the copper and gold provides extra protection against copper dissolution. This is a nice piece of insurance especially when performing rework. Cheers
Electronics Forum | Sat Jun 06 15:16:17 EDT 2009 | jameskelch
Here is a link to a recent industry article that may be of service: http://www.pcb007.com/pages/zone.cgi?a=49717
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