Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Fri Jan 15 14:45:48 EST 1999 | Earl Moon
| | | Folk's, | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how long do
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Fri Feb 11 15:33:52 EST 2000 | Steve Thomas
We're considering an ENIG finish on some of our boards to resolve some coplanarity concerns with 20 mil pitch QFP100s. I welcome any comments on the subject, especially regarding solderability and the variables of ENIG that affect it, but would part
Electronics Forum | Tue Aug 15 16:57:54 EDT 2000 | Doug Philbrick
In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA
Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup
Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect
Electronics Forum | Mon Apr 17 16:17:47 EDT 2000 | Dennis Fall
Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am intere
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