Electronics Forum: osp finish (Page 1 of 23)

osp finish

Electronics Forum | Wed Jan 21 05:01:10 EST 2004 | sd

Does anyone have any reports on OSP pcb finish and ICT Testing? Having a problem with contact issues.

osp finish

Electronics Forum | Fri Jan 23 09:21:49 EST 2004 | Kris

Thanks Guys

osp finish

Electronics Forum | Wed Jan 21 09:36:52 EST 2004 | davef

As with noclean flux, OSP will fill your probes with crunchy [maybe gummy] stuff. Consider: * Increasing frequency of probe maintenance * Talking to your probe supplier about alternate probes that self-clean better

osp finish

Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel

Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.

osp finish

Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris

Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks

osp finish

Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef

Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.

osp finish

Electronics Forum | Thu Jan 22 08:48:42 EST 2004 | patrickbruneel

Kris, You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www

Pad finish

Electronics Forum | Wed Oct 06 04:11:35 EDT 2010 | grahamcooper22

I've done minimal research to this point and > understand my issue with solder on the double > sided boards is due to oxidation that occures on > the unpopulated pads when the board makes its > first trip through the reflow oven. > > We did run

Pad finish

Electronics Forum | Thu Oct 07 15:50:57 EDT 2010 | boardhouse

Craig & Rem - I would also recomend switching to ENig - OSP would be my sencond choise ENig will give you the flatness your looking for plus the best shelf life. Enig is about 5% more than Hot Air. Enig also does not cause as much stress on the c

ECOs on OSP finish

Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan

Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.

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