Electronics Forum | Mon Jul 31 11:52:35 EDT 2000 | Brian W.
PJ, Have you already done your process cause and effect diagram? That is the step that allows you to define your PFMEA. I went throught six sigma training with one of my customers, and they used Air Academy Press out of Colorado Springs for thei
Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Thu Jul 13 04:56:29 EDT 2000 | dutkell
John, I totally agree with you on all your above comments. You obviously have a real grasp of your subject, and are very knowledgeable. My colleague and I would like to take this opportunity to request information on personnel ' training' aspects re
Electronics Forum | Thu Jul 06 13:31:35 EDT 2000 | Michael Parker
Thanks Dave for the right methods that will get Patrick out of his mess. As long as one is a "Do it yurselfer". I still advocate having the supplier accept responsibility and clean the boards. After a bit of elbow grease, some cussin' and lost time I
Electronics Forum | Thu Jun 29 11:52:23 EDT 2000 | JAX
sree, There is no Definite. You have to make the call. If you think the previous info was on target, use the info provided to find out the appropriate percentage relation between ball diameter, pad diameter, and aperture size. If you already run BGA,
Electronics Forum | Wed Jun 28 22:21:39 EDT 2000 | Peter Lopez
I trying to find out information on how a normal process will look like with COB's. Questions I'm trying to answer are... Are SMDs and COBs normally on the same side? If yes, SMDs will be place first then the COB's. Is this assumption true? How
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
Electronics Forum | Fri Jun 23 10:00:08 EDT 2000 | Chrys Shea
Yeah, them soldering machines sure got some demons in them...My waves used to get blamed for wrong polarities all the time. Sneaky little devils used to pull components out of the boards, flip them around, and get the pins back in the holes while
Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F
John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the
Electronics Forum | Mon Jun 19 10:46:53 EDT 2000 | D.J.
Does anyone out there have a Vitronics SMR400 or SMR410? Trying to get facilities specifications for amperage at 208 vac, and also any information for rail adjustment procedure for dual rail. Did Vitronics offer fixed tooling rail adjustment, are t
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