Electronics Forum: out (Page 411 of 1200)

Fog Test

Electronics Forum | Fri Jul 26 14:36:31 EDT 2002 | blnorman

Is anyone aware of a fog test for flux or flux residues? Supposedly one of our vendors had a test, but we've lost the specifics. We're interested in finding out if after heating, some of the residues (retained volatiles, or whatever) will escape an

Super M.O.L.E or Slim KIC 2000 for oven profiling?

Electronics Forum | Tue Jul 30 14:07:01 EDT 2002 | cnoonan

Slim KIC would be my choice out of these two vendors. I have worked with several different makes and models and I would say DataPaq was my favorite. But it all depends on your needs and budget. They can all get the job done. Good luck with your

Maintenance software

Electronics Forum | Tue Jul 30 12:03:41 EDT 2002 | rbrack

I would like to integrate all our maintenance procedures / shedules etc in one software package. Does anyone have any experiance, good or bad, of any systems out there? A rough idea of price would also help. We have three SMT lines with around 10 m

Glue & Paste Printing on Same side of the PCB

Electronics Forum | Thu Aug 08 15:16:03 EDT 2002 | OhioD

A "Pumpprint" stencil refers to a thick DEK stencil with pockets routed-out on the underside, so it will clear any THT leads, paste/glue deposits, etc., and not squish them. It's called pummprint because it was developed to use the ProFlow-type head

dry oven

Electronics Forum | Mon Aug 12 19:35:42 EDT 2002 | sleech

Been there, ... done that,...got the T-shirt. When with a major IC manufacturer, we tried this. IT DIDN'T WORK! The problem was that most convection ovens leak. We could not achieve a significant N2 atmosphere.Eventually went to vacuum-assisted bak

VIA HOLES ON SOLDER PAD

Electronics Forum | Tue Aug 06 22:20:32 EDT 2002 | Computer

Hi , I am currently faced with a problem with the via hole on the component pad. The customer does not allow plugging of the hole and enlarging the stencil pad hole size or thicker stencil size may cause bridging to the component next to it.

oven resin from adhesives

Electronics Forum | Wed Aug 14 10:01:42 EDT 2002 | davef

No. Since most glues don't don't give-up many solids, we're [at least I am] speculating that you are using the same oven for both reflow and glue cure and that the 'slime oozin' out from your TV set' [FZ 'Overnight Sensation']. Ooops, no the slime

OSP and SIR

Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend

Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo

OSP / Paste Printing Problems

Electronics Forum | Thu Sep 12 18:50:17 EDT 2002 | scottefiske

Sorry so late in getting into this tehcnical issue. I have seen this condition before...90% of the time in conditions of adhesion on a water soluble material... is the paste...exposure time, lot issue, etc..basically the paste's carriers and binders

Poor Fuji recognition of PhyComp 0603 (1608) cap

Electronics Forum | Fri Sep 20 05:17:10 EDT 2002 | byates

What are the error codes?? you dont even know if it is the vision type until you have checked this out. It could be camera lighting. Do you know how to use vision trace on your machine? What is your x&y tolerance? What about vision 254 or 255 have yo


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