Electronics Forum: out (Page 821 of 1205)

Re: Solder Balls

Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup

Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us

Re: Flux tanks

Electronics Forum | Fri Nov 05 21:29:56 EST 1999 | chartrain

No matter what type container you use, air in the delivery line will always be a problem. When you pop the lid on a pressurized container, fill it with a liquid and reseal it, air will be present over the liquid. Where do you think it goes?It has to

Re: Moonman - may I join you?

Electronics Forum | Thu Nov 04 17:33:24 EST 1999 | John Thorup

Yes, the Moon has set. Final signoff was 10.1.99 and several threads appearing in the previous 10 days or so sort of say why. List by author to check. I was out for most of this period and missed it as well. I went looking after Brian's post. I

Re: Strange S-20

Electronics Forum | Wed Nov 03 04:02:51 EST 1999 | Wolfgang Busko

Hi Wes, it may not be the same but I had a problem with one Phillips machine which started unpredictible mismounting all components about 1mm. When it occured you couldn�t get it do it right again unless you turned it down and restarted it. The servi

Re: Wow! Those are low limits.

Electronics Forum | Thu Nov 11 17:17:11 EST 1999 | Boca

1. Most ionic testing is measured in NaCl, that is, the ionic residues are quantified in terms of NaCl equivalence. The test does not determine what the ionic residue is, just its relative strengh. 2. I use IPC cleanliness specs on OA fluxes but n

Re: 0603 Solder Beads

Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain

Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no

Re: flow thru

Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain

You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for

Re: Press for press fit connectors

Electronics Forum | Mon Oct 25 17:06:18 EDT 1999 | William

Mario, If you are looking for a cheap press to do press fit connectors, then you are asking for trouble. Now, and in the long run. ASG out of West Palm Beach makes a very good press. We bought a 5 ton version and are able to press up to about 2500

Re: solder mask wrinkles

Electronics Forum | Tue Oct 19 19:25:40 EDT 1999 | Jeff Sanchez

Carol, I think the guys are right about you stand off problem but I want to address the wrinkleing of your masking. Although I think the temps you are subjecting the board to are very high and more than likely creating problems of their own. I th

Re: Fingers on Wave Machines

Electronics Forum | Fri Oct 22 11:25:03 EDT 1999 | Boca

I understand what you're looking for, criteria which determmines a good or bad finger. I have not found anything as cut and dried at that, we just eyeball them. If they are very bad they should stick out like a sore thumb. We check for them each s


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