Electronics Forum: ovens (Page 176 of 509)

Bottom side process question

Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman

We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.

reworking brds by flowing the board thru' oven for the 3rd times

Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve

Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.

reworking brds by flowing the board thru' oven for the 3rd times

Electronics Forum | Tue Mar 20 18:51:34 EST 2001 | gburson

Another consideration is that heat damage is accumulative. If you have temperature sensitive components, that third reflow may be bringing them close to their failure point.

Anybody can tell me log in password for Vitronic smr800

Electronics Forum | Tue Mar 27 13:46:23 EST 2001 | MR

Try passme as a password. this was good on some of the older vitronics ovens.

THERMAL PROFILING

Electronics Forum | Thu Apr 12 15:16:35 EDT 2001 | Rex Breunsbach

Profiles design is primarily determined by oven geometry, paste specifications and component thermal limitations. This means that no one "standard" profile exists for all production. A free profile planning utility can be quickly downloaded from

Solid Solder Deposit

Electronics Forum | Tue Apr 24 10:37:45 EDT 2001 | caldon

A small SMT line? I have conections for a New screen printer (MPM), Essemtec Placement machine, and Reflow oven (Electrovert) for $100K Let me know how interested you are. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org

Reflow Oven vs 0402 Tomb Stone

Electronics Forum | Mon Jun 11 21:27:43 EDT 2001 | procon

Way to go CPI! This is a classic example of design. Many people experience this when the have an 0402 close to a QFP or other large components. The pad closest to the larger component will become liquidous later than the pad farthest. Hence, a new t

effective liquor for cleaning the residues in reflow oven

Electronics Forum | Wed Jun 13 17:17:57 EDT 2001 | medernach

I use BioAct SC-10 and it seems to work pretty well. The best bet is to contact your solder paste manufacturer and ask them for a recommended cleaning solvent for the flux residues... Regards, Justin

Question on Reflow Profile Development

Electronics Forum | Wed Jun 13 21:32:26 EDT 2001 | davef

One or more of the oven profiler companies [eg, KIC, ECD, Datapaq] has software for estimating profiles. Checkem aut.

Question on Nitrogen Consumption during Reflow

Electronics Forum | Mon Jun 25 14:26:50 EDT 2001 | gdstanton

I'm trying to hammer out the setup and operational costs to add Nitrogen to our SMT reflow process. Anyone have an idea on how much liquid N2 they consume monthly on an Electrovert or Conceptronics reflow oven? Thanks in advance for your help.


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