Electronics Forum | Wed Jan 08 17:46:34 EST 2003 | ricardof
I would like to know how to implement CPk study on SMT line At this time we have the application to calculate CPk on Chip Placers for X and Y axes repeatability, but I'm trying to find what should I calculate on my Oven and paste printer in a simple
Electronics Forum | Thu Jan 16 13:51:00 EST 2003 | ricardof
Thank you Jon I'm very interested in finding some more info on what to get and measure on the Paste Printer and the Oven (DEKs and Vitronics)
Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Thu Jan 23 16:59:14 EST 2003 | barry
what are the methods used out there to verify reflow oven performance or machine profiling. What intervals are good practice and is it necessary. We do product pofiles with our profiling equipment and can that be used to base your machine performance
Electronics Forum | Fri Jan 24 09:33:36 EST 2003 | pjc
ECD has a product called the OverRIDER for benchmarking and trending oven performance. http://www.ecd.com/emfg/instruments/ovenrider/
Electronics Forum | Thu Feb 20 11:57:48 EST 2003 | mdm4ua
I placed a micro bga using flux paste and ran it through my oven and it came out as if someone had pushed down on one side. I can find no reason for this, has anyone ever seen this and how did you fix it?
Electronics Forum | Fri Mar 07 12:27:04 EST 2003 | msivigny
Hello Doug, thank you for the additional commentary, it has reminded me of another reflow recommendation that I'd like to make in general for readers. It's not specific to O2/N2 in ovens but in the method for creating and managing profiles for numero
Electronics Forum | Thu Mar 27 23:31:18 EST 2003 | MA/NY DDave
Hi I hope I am replying in the correct tread down link. J.Fox is right. Know the Assembly / PWA that you are processing. YiEng, MA/NY DDave
Electronics Forum | Fri Mar 28 04:57:41 EST 2003 | emeto
more heat.But that's not correct!If convection there are air flaws and bare board has lower temperature than a board with high density.When you have elements on board you hava a vortex and the air flaw invreases the temperature.
Electronics Forum | Wed Mar 26 15:46:43 EST 2003 | Ren�
To remove or Place a BGA in a BGA reworks machine , do I have to do a same profile as a normal Oven ( around 4.5 mins to Peak time ) or the conditions are only to get temperature needed to Solder or Remove ( no matters Time).
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