Electronics Forum | Sun Feb 11 23:18:44 EST 2007 | M.Haris
1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? 2. What is the �Low- Temperature Phase� in any solder paste alloy? 3.W
Electronics Forum | Fri Feb 16 13:43:07 EST 2007 | ck_the_flip
Hi Darby, Where did you get the info. that cooling rate is not-as-critical for lead-free? I'm not doubting you, and I actually want this to be the case. We don't have chillers on our ovens, and on fast profiles, we only achieve 2 to 2.5 deg. / s c
Electronics Forum | Sat Feb 17 14:21:54 EST 2007 | Muhammad Haris
Hi All, I am using YV100Xg YAMAHA Pick and Place Mounter Machine and I am facing a tilting problem of PLCC 84 and QFP 240 pins ICs. I deeply checked about their vision files and place them on the double sided tape and found them ACCURATE on their pad
Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Thu Feb 22 09:21:57 EST 2007 | Cmiller
Mydata would be good, Contact Systems would be good for what you are doing, very good software, crappy feeders but fine for 0805 parts. You may be able to get a Universal GSM pretty cheap these days. If you make a decision then look for a machine you
Electronics Forum | Fri Feb 23 15:14:51 EST 2007 | James
I have this board that we are currently having problems with. When we run the BGA side with the hotter temp. the connectors on the other side lift off their pads. The BGA is lead free, that is why we have to use the hotter profile. Would it be
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Mon Mar 05 11:51:21 EST 2007 | muse95
Join the "big issue" club. We were just reading the "fine print" (no, it wasn't fine print...) in J-STD-033, and noticed that we overlooked the requirement that when baking at 40C (or any temp below 100C) the humidity in the oven must be controlled
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
Electronics Forum | Mon Mar 12 22:02:20 EDT 2007 | Narksh
i i'm new in this of smt, i know how to solder a circuit manually but i need to know all the process and all the needs to made a smt impressed circuit what else i need to made a manufacturing line apart than: stencil printer, pick and place sistem a
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
