Electronics Forum: package size (Page 16 of 39)

How to optimize the PCB design layout on CAD packages?

Electronics Forum | Wed Nov 16 11:30:20 EST 2005 | nkbkiran

If PCB board size is my constraint ....and I have designed my circuit ... 1. How to optimize the layout of design for smaller space? 2. How to run simulations if any to do intelligent SI test? Does packages by Cadence, Mentor support this kind of o

Re: BGA PAD REDUCTION

Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn

| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going

panelization software

Electronics Forum | Fri Feb 23 15:22:42 EST 2001 | micah

Can anyone recommend a good software package which can be used to create panel criteria from Gerber/Cad data. Needs to do more than step & repeat. Need to be able to define panel size, add panel fiducials, define breakaways and hole sizes, ability

Samsung CP45FV Neo Programming

Electronics Forum | Mon Mar 03 07:15:24 EST 2014 | JB

Thanks for the reply, how do people handle different packages then if you can't add new ones? If we had a 1206 sized inductor, then a 1206 sized ferrite bead and so on, they would all have to be grouped under the same generic heading? e.g. Chip-R321

Substitute parts

Electronics Forum | Tue Aug 31 13:54:50 EDT 1999 | David Spilker

Do any SMTneters out there have a good solution to substitute SMT parts that you are willing to share? I presume all of us have the issue where purchasing wants to buy "the same part" from a different vendor. While the part may be the same electrical

BGA opens / cracks

Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty

Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for

Component Database and Placement List

Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice

For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in

BGA Inspection Criteria (IPC-7095)

Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong

Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on

Board dimensions of a VMU

Electronics Forum | Tue Aug 28 14:11:18 EDT 2001 | SR Evers

I am designing a range of electronics packaging. Can anyone tell me where to find the dimensions of a VMU "C" sized circuit board?

VMU

Electronics Forum | Mon Sep 03 09:37:44 EDT 2001 | SR Evers

I am designing a range of specialty electronics packaging. Can anyone tell me where to find the dimensions of a VMU "C" sized circuit board?


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