Electronics Forum | Mon Aug 13 12:03:50 EDT 2007 | davef
Test results indicated that the life of lead-free solder at a 2512 chip resistor could be worse than of SnPb solder in the accelerated thermal cycling condition. [Development of Life Prediction Model for Lead-free Solder at Chip Resistor, Changwoon H
Electronics Forum | Thu Nov 01 16:41:13 EDT 2007 | slthomas
That might be the stuff. I think what baffles me is that it was readily available and packaged as "thermocouple attachment solder" or some such description, but they apparently don't seem to have it available by that name. It's not a critical issue,
Electronics Forum | Wed Nov 07 14:58:47 EST 2007 | slthomas
Aside from answering the obligatory "why on earth would you want to do this yourself?) pitches, you need to tell us more about what kind of packages (component body types....0201, 0805, QFP, BGA) are going on to the board, how many you plan on buildi
Electronics Forum | Fri Nov 09 10:37:38 EST 2007 | devajj
We have started using QFN packages in large volume and are having problems with no-solders. We are using 6mil stencil with 1x1 paste print to pad. These also have thermal pads with thru vias that we reduce the stencil aperture by 1/4. Board also ha
Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
Electronics Forum | Wed Nov 14 20:06:20 EST 2007 | petep
I would like a nicely packaged set of assembly tools (green handles and pouch) for use with RoHS assemblies. I have Green mats, dedicated irons, but would like clearly identifiable tools to better segregate the process. Can any of you provide a Man
Electronics Forum | Fri Nov 16 08:46:30 EST 2007 | jdengler
For very simple boards, 2 layers lightly populated with light thermal mass, we still use FR4. For most of our Pb-Free boards we use the higher Tg material with moisture-resistant packaging. We are a CM so we don't usually get to change many of the
Electronics Forum | Fri Jan 25 18:22:03 EST 2008 | mobytahoe
We have evaluated (in-house) the following machines: Agilent SP50, CyberOptics SE300, Siemens OS. We have also evaluated the MVP machine and the Orbotech machine off-site. Best bang for your buck??? CyberOptics by far! Better Gage R&R, better standa
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Wed Jan 30 15:02:04 EST 2008 | minimicro
Steve, Don't worry about it. I can put together a package of X-ray and Optical inspection for less than you think just the X-ray would cost. Give me a call and we can discuss it. Gary 760-458-0733
