Electronics Forum | Sat Dec 30 19:02:19 EST 2006 | mika
This type of component packages works best with vision type: 254 - irregular. Measure the total package length including the leads. Also set the body dimension x-y tolerances to at least 0.35mm and the the pick up x-y tolerences to 0.5mm in the part
Electronics Forum | Sat Mar 24 05:25:07 EDT 2007 | mika
Thanks aj, Ohh I wish that there was a way to post a picture in this forum or a possibility to attach the datasheet... Which BTW does not have any recommendation of "how to". This package does not have the "center thermal pad" like a QFN or MLF pack
Electronics Forum | Tue Jul 10 11:25:36 EDT 2007 | jax
Multiple Factors that account for Scrap: During Set-Up: A percentage will not work. When setting up feeders you will normally use a certain length of populated pockets. The amount of parts this affects depends on 1.type of feeder 2.type of part
Electronics Forum | Mon Sep 18 05:46:07 EDT 2017 | spoiltforchoice
As Evitomov says, provided you check everything is setup correctly there should be no issue. There can be some variation between manufacturers as to how they package certain components. For example 2512 resistors are usually in 12mm tape with a 4mm s
Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice
For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in
Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T
| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |
Electronics Forum | Fri Aug 06 07:18:48 EDT 1999 | Graham Naisbitt
| | | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmenta
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
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