Electronics Forum: packages (Page 196 of 288)

BGA Inspection Criteria (IPC-7095)

Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong

Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on

how to protect pads while applying solvent green mask? cure?

Electronics Forum | Wed Jun 18 07:49:06 EDT 2008 | more_sunshine

hi i'm not experienced in creating pcbs but i have good background, and i have a bunch of questions. i have no access to world wide known pcb chemicals but i managed to get a cramolin positiv spray and i don't know if it is still usable or not? (di

OT: Wavesolder Process Engineer Needed

Electronics Forum | Tue Jul 01 12:35:18 EDT 2008 | amcross

Please accept my apologies for being offtopic. I have tried posting on the career center, and our job even appeared at the top of the most recent smtnet email newsletter. Still, we received essentially zero response. I'm hoping maybe a post here mi

Effective Part Numbering System Used For Contract MFG. Co

Electronics Forum | Thu Jul 03 09:12:08 EDT 2008 | andrzej

Hi, if you do only contract services I`d advice own part numbering. All I can say is just try to create each cathegories which will contain other cathegories and so on. Applying this system will make some order in your stock. For instance : RETR020

Latent shorts on QFN package

Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42

Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a

Recommendations on Solder Scavenging Systems

Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef

Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X

Completed Assembly Storage Life Question

Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef

From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st

SMD Marking Code unrecognise

Electronics Forum | Sat Sep 29 02:58:18 EDT 2012 | ericrr

I tried to look for "H890" on Internet and went nuts, (Thanks to Google) I would think H890 is part of a diode manufacturer part number. Have you tested it for a diode function? or maybe you have this is why you want a replacement. Tantalum capacito

Yamaha or Europlacer?

Electronics Forum | Fri Feb 13 11:22:17 EST 2015 | slarochellesmt

I can offer some background on the IINEO II as I feel it is much better than the Yamaha. I currently have 3 IINEO IIs in production that replaced 3 Assembleon lines. The IINEOs handle quick changeovers better than any SMT line that I have used to d


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