Electronics Forum: packing (Page 36 of 46)

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

Ready, Shoot, Aim!!!!

Electronics Forum | Tue Mar 20 09:21:47 EST 2001 | Claude_Couture

I got into the electronic assembly business because I love fixing machines. It is very satisfying to see an assembly line working the way it should. Then comes the new operator, and the output graph goes down. If most root causes are the human facto

Re: Moisture sensitive Devices

Electronics Forum | Wed Feb 09 21:33:32 EST 2000 | Dave F

Ashok: I have three answers to your questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opene

Re: Frameless Stencils

Electronics Forum | Thu Jan 13 14:16:32 EST 2000 | mike d

Michael, Good afternoon. My experience with the frameless stencils has been less than optimal. I tried the universal stencil system about a year ago and these are my experiences. 1) The stencil manufacturer supplied me with a free frame to try ou

Re: Trays - Conductive vs Anti-Static??

Electronics Forum | Mon Oct 11 05:48:17 EDT 1999 | Brian

| I am checking out trays for packing of Simms, and I would like to know what are the main differences between Anti-Static and Conductive trays. Anti-static are cheaper, but I would like to know about properties of one against the other, what are var

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.

Re: Best reflow temperature

Electronics Forum | Wed Sep 15 12:07:50 EDT 1999 | Earl Moon

| | Hi, | | | | Can someone pls suggest to me the best reflow temperature setting | | for a force air convection oven. The details is as follow. | | 1) Heller 1700s | | 2) 12 zone---6 top and 6 bot | | 3) Solder paste --- Qualitek 691 non clean | |

Re: Proflow of DEK screen printer

Electronics Forum | Sat Sep 04 09:31:35 EDT 1999 | Earl Moon

| | | Dear sirs, | | | | | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | | | | | Best regards, | | | | | | Jame Bond | | | | | | | | James, | | | | Stir, don't shake is not good advice for c

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:26:02 EDT 1999 | John Thorup

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so


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