Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ
Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You
Electronics Forum | Thu Jun 15 16:19:08 EDT 2000 | LeeAnne Wambolt
Raeto, IPC-SM-782 will give land sizes for both reflow and wave soldering. LW
Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44
I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?
Electronics Forum | Fri Mar 24 14:06:07 EST 2006 | mdemos1
Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern? Thanks, Mike.
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
Electronics Forum | Fri Oct 27 08:24:41 EDT 2023 | avaqsemi
When designing a PCB to accommodate an intrusive reflow narrow profile connector (electrode rectangular) with specific dimensions, you'll need to consider the pad size, hole size, and other factors to ensure proper solderability and mechanical stabil
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Sat Apr 14 03:34:23 EDT 2001 | kpliew
Hi Greg, If u don't mind my recommendations. U may want to try to convince them that by using smaller pad size , u save solder paste in the end of the day (provided u are doing mass volumes). It is another way of getting around to ur idea of changin
Electronics Forum | Tue Sep 14 17:06:25 EDT 2010 | asksmt
Hi All, I have designed 4 Layer PCB with one 28 pin QFN PKG. I have got complaint from Production that the pads which connected to thermal pads (gnd) thru trace is bridging with solder and because of this bridge, pins are not getting soldered prope
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