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Electronics Forum | Wed Mar 26 17:09:52 EST 2003 | Jos�
For the Resistor Network Array SMT 0402- 8 pads I'm using a Stencil 5 mils Th. with the next appertures : Corners-biggers pads: 24 x 12 mils Center pads : 9 x 24 mils This Appertures are working excelent for the RN's that his appertures are parallel
Electronics Forum | Thu Jul 17 16:07:23 EDT 2003 | davef
So, how do you know it's "oxidation"? If the parts didn't solder, why aren't the parts the problem? Do the parts take-on solder? Please describe: * Appearance of the post-solder components. * Scope and extent of the problem. * Appearance of the po
Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Wed Oct 29 23:40:29 EST 2003 | ppcbs
We here at Precision PCB Services, Inc. Perform selective ball removal. We just completed a job today where we removed 4 balls, and then installed traces to dog-bone the pads at two locations on 30 BGA's. An eaisier and more cost effective solutio
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Thu Apr 01 12:31:39 EST 2004 | russ
one more thought on this, When these boards are built new do we not have solder paste on the ground pad and then reflow? Has this caused any misregistration for you? I am assuming that you are not pasting the leads with the ground pad correct? I
Electronics Forum | Tue Apr 27 15:18:13 EDT 2004 | Claude_Couture
No offence, but have you ever used a soldering iron? The usage dictates the shape you need. small pads require small tips, big pads require big tips. Then you have chisel tips, cone tips, etc... that is to your preference or what you feel more comfor
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
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