Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Fri Jan 12 19:36:36 EST 2001 | Brian W.
Cyberoptics makes a device called a Cybersentry. wonderful machine. Will work in line or off line. I used one in a former company. You program what pads and locations you want, and it can measure volume or height, and give you charts. You can en
Electronics Forum | Fri Dec 29 16:05:56 EST 2000 | Dave F
I don't know how I ended-up reading a current trade journal, when I have a stack of intentions behind my desk a foot and a half tall, leaning like a paper Tower of Pisa threatening to avalanche itself onto the underfill materials study, a meager one
Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F
Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther
Electronics Forum | Fri Nov 03 11:08:29 EST 2000 | Phil
Hi there!!! Actually, all mentioned ideas were significantly related to the cause of tombstoning. But, based on what DL said, you have to check the placement of your 0402. Coz, based on experience, i evaluated the different variables for the root
Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd
Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
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