Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Tue Nov 09 05:14:49 EST 1999 | Wolfgang Busko
Hi all, our problem we face is the mismatch of conductor width on the delivered PCB and the nominal width given by CAD-data. With CAD we are improving pads and conductors to match the specific needs for soldering and the board houses counteract our i
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Wed Oct 20 04:42:02 EDT 1999 | park kyung sam
we did this for pad design of pcb and can also use it off- line programming for mounter. we had checked out all the component we used in our factory. we sorted 600 kinds parts using part size(L,W,T) ,number of lead ,shape with over 6,000 parts. a
Electronics Forum | Wed Oct 13 23:57:55 EDT 1999 | se
As a stencil vendor to some assembly houses and small in-house assembly shops, both without CAD people rushing to put the paste layers (if they even generate one) into stencil friendly format, the silk screen is the only communication tool we have to
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Tue Sep 21 04:00:27 EDT 1999 | Wolfgang Busko
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | We use 6 mil lasercut stencils with 15% reduction and th
Electronics Forum | Wed Sep 08 13:09:40 EDT 1999 | Joe Wayt
Hello: We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When the
Electronics Forum | Tue Aug 24 16:11:21 EDT 1999 | Scott Cook
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
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