Electronics Forum | Fri Oct 16 14:11:16 EDT 2009 | davef
thermal and pad
Electronics Forum | Wed Aug 17 12:26:06 EDT 2011 | rdubya
Hey all need your input, this looks like classic black pad to me. what do you think?
Electronics Forum | Thu Jun 13 02:20:43 EDT 2013 | mun4o
put the silk screen mask between pads.Add drain pads after TO220.
Electronics Forum | Sun Sep 07 13:33:50 EDT 2014 | horchak
Edri PCBA design and pad geometry is one of the critical factors for BGAs. Typically the pad size for collapsible balls is 80% of the ball diameter. Pad size consistency is critical. In your situation what will happen the larger pads will wick the s
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Mon Aug 03 03:24:03 EDT 2015 | leeg
What positions do you need to measure? Pad to Pad or corner to corner?
Electronics Forum | Wed Aug 05 02:20:19 EDT 2015 | preeti1203
Any dimensions.. it could be from pad to pad or board outline.
Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining
Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t
Electronics Forum | Thu Aug 18 00:19:09 EDT 2016 | souldierann
Hi there. would it be possible that thermal relief pads for relay bring bad solder?
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
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