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Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark
You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is
Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ
What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o
Electronics Forum | Wed Apr 21 00:14:10 EDT 2004 | ramanandkini
We wish to use rectangular 4 segment solar panels in our quartz watches & charge the battery. The size of the soalr panel is 18.20mm X 7 mm and the thickness is 1.15mm. The other popular application of this type solar panels is in calculators. These
Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ
So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ
We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Tue Dec 14 06:41:43 EST 2004 | clampron
Good Morning Everyone, I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will process more like a column grid array where the 63/37 will
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