Electronics Forum: palomar (Page 1 of 1)

Re: wafer to waffle

Electronics Forum | Mon Sep 11 20:41:09 EDT 2000 | Dave F

Try: * Semiconductor Equipment 5154 Goldman Ave Moorpark CA 93021 805.529.2293 fax 2193 * Palomar ?? (Hughes Aircraft, Technology Products) 2051 Palomar Airport Rd., Carlsbad, CA 92009 619.931.3622 fax5191 Jeff King appl x3629 * Kulicke&Soffa, 201 B

Manual for a Hughes/Palomar

Electronics Forum | Tue Jun 13 13:34:10 EDT 2006 | jsmith01

Does anyone have a Manual for a Hughes/Palomar Htt-1000 power supply and a VTA-96 weld head? I acquired these machines to do a small job that we need to attach a flex cable to a thermal print head. As far as I can tell this division of Hughes was s

Flip chip or wire bond?

Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox

This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l

Large Area Wire/Wedge Bonder

Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit

Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak

Large Area Wire/Wedge Bonder

Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz

Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:05:23 EDT 1999 | Dave F

A potential customer of our is inquiring if we have capability for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. Gary: Tell your customer NO

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

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