Electronics Forum: panadata and terminal (Page 1 of 5)

QFN's and LGA's

Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge

Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

Spacing and Yield

Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake

The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Jan 15 07:23:14 EST 2021 | denism

Also, solder splashes can be due to contamination, for example, on the terminals of components. In the past, had a problem with solder splashes on a seemingly standard SMD component. The reason was the incorrect nickel plating process of the componen

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef

You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a

J-STD-002 and -003 solderability testing...

Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo

This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

CIM systems and Final Assembly

Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp

I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

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