Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Tue Oct 27 15:25:02 EST 1998 | Stefan W.
Hi Samson ! In order to give you more detailed information I would like to know what your component range is and how many boards you supposed to do. Panasonic and MPM are a good choice, however, Panasonic has not many P&P machines on the U.S. market,
Electronics Forum | Thu Sep 03 15:43:18 EDT 1998 | Tim Flanagan
I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior for
Electronics Forum | Tue Aug 18 16:10:40 EDT 1998 | Earl Moon
| Question: | If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? | I'm currently running into this
Electronics Forum | Fri Jul 17 11:57:25 EDT 1998 | Justin Medernach
| I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress di
Electronics Forum | Wed Jul 15 19:54:47 EDT 1998 | ZULFIQAR
| | | | | | Dear Colleagues: | | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | | I need data not opinions. | | | Thanks in advance for your help.
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach
| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in
Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Wed Mar 20 11:47:06 EST 2002 | Hussman
Ron, Some places want/need oven calibration and some don't, just need a profile. I've worked for both. If you need oven calibration, an easy, inexpensive way is to parallel thermalcouple wire to your existing thermalcouples. Terminate the ends of
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