Electronics Forum | Fri May 22 22:18:18 EDT 1998 | David Newman
Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and capacity
Electronics Forum | Tue Jun 09 17:01:02 EDT 1998 | Earl Moon
1/8" cutters, although they can only be used | with our newer height-controlled machines. | 3. Reduction of operating parameters. Reduced Z-axis plunge rates for the | larger cutter sizes. | 4. Addition of a 1/2 sec. dwell at the plunges. The small
Electronics Forum | Fri May 01 18:01:04 EDT 1998 | Peter Soland
Has anyone experienced profile related microbridging under 0402 capacitors in the past. We use a Sn46Pb46Bi8 paste, 178 degree C L.T.. Double sided board, 2 per panel, 6.5" x 5", convection oven. Profile data; thermalcouples @ components showing 200
Electronics Forum | Fri May 01 22:32:38 EDT 1998 | Jon Medernach
A pad design shaped like Home Plate will eliminate the problem, You can get info from Create Group at Panasonic FA They have the patent on this style pad and the most experience working with the 0402 and now have qualified the 0201 Caps from Murata
Electronics Forum | Thu Aug 23 16:41:06 EDT 2001 | slthomas
Naw, the rest of the BOARD we use them on. Same assembly. Actually we use them on one other assembly and have the same problem. Same oven, same line, same paste, same problem. I've tried to get the production super. to move them to another line w
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc
I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Mon Sep 23 18:17:20 EDT 2002 | MikeF
Actually, I have found this thread interesting as well as lively, especially since I may soon be in a similar position. I have thru hole background, but my smt experience is mostly at the prototype level. Of course, I'm in a good position, John Stima
Electronics Forum | Fri Oct 25 11:21:05 EDT 2002 | soupatech
This may sound like a stupid question but keep in mind I am very new at this and most of the training I have recieved has been from operation manuals and this forum (thanks to all). Our purchasing agent (new hire) is ordering a stencil for the first
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