Electronics Forum: parameters (Page 41 of 103)

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 05:26:53 EDT 2000 | Mika Pirttimaa

Well, Yes those measurements are required as long as your process is not in control. It is true that quality people easily demand too much and are too strickt in the areas that are not so important. Height of the pad is one of them, it is not very in

Re:Diff. Epoxy resin (ER) conformal coating Vs ER adhesive bonding matrl

Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.

Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec

Re: Component Failure caused by Hot Air Knife

Electronics Forum | Wed Sep 20 17:06:23 EDT 2000 | jackofalltrades

On the Vitronics/Soltec Wave Soldering Machines, we have no problems with the hot air knife (called a "Select X De-Bridging Tool" by Vitronics). We have both Delta's and Delta Max's. We have used both air and nitrogen with no problems. When using a "

Capability Study for Solder Printing Process

Electronics Forum | Tue Sep 19 22:15:53 EDT 2000 | Sophia

Hi guys, I have been working in the SMT pick and place process for five years, and now I'm responsible for the solder paste printing process, and one thing that I notice is that the actual process that we have is to poor, actually our main defects a

Re: 0201Technology (

Electronics Forum | Mon May 22 10:43:05 EDT 2000 | TMV

The SMT LAB at Universal Instruments Corp. has presented a paper entitled "Process parameters optimization for mass reflow of 02\01 components" at APEX 2000. If you weren't able to attend, an excerpt is available at www.UIC.com, under the AUTOMATION

Humidity control in assembly area.

Electronics Forum | Mon May 01 17:29:25 EDT 2000 | Joe

Hi, We have a climatic controlled assembly area, with a constant temp of 22 deg C and a relative humidity of 40 - 50 %. What I would like to ask is how should I approach a situation when the humidity starts to decrease to below 40%. The situation I'

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo

Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so

Re: PCB finishing

Electronics Forum | Fri Apr 14 10:16:27 EDT 2000 | PeterB

Dave, 'Free Issue' here in the UK means material (be it PCB's or anything else) supplied by our customer from their stock and not charged to us. That is why we sometimes cannot control the design parameters. Many thanks for the suggestions. We alre

Re: HAL vs. Silver Coated

Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko

Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s

Re: SRT Rework Station, Model FPD-W

Electronics Forum | Thu Feb 24 14:03:59 EST 2000 | John Cudmore

Brian, The SRT FPD-W is an older unit that has been successful for a long time. We have used it at BEST with good results. The SRT FPD-W is a very good machine for the uses you mentioned except possibly for the BGAs. I have seen some used for BGA


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