Electronics Forum | Mon Nov 11 11:43:54 EST 2002 | soupatech
Thanks for the suggestions. I should have been more clear when I said "loose parts". Along with the truly loose parts I have many strips of 50 to 1000 on reels (not marked) and in bags (not marked). I guess if I cannot determine all of the tolerance
Electronics Forum | Mon Dec 16 15:38:17 EST 2002 | Randy Villeneuve
No parts or boards are baked unless they are moisture sensitive and were left out too long and that is for reflow only. In your case there should be no reason to bake becouse the boards should be vacuum packed as they come in as well as any moisture
Electronics Forum | Fri Dec 20 12:12:12 EST 2002 | russ
Thanks Dave, I was looking in the Murata data base and couldn't even find the part (Even though they are the ones making it)let alone the pad dims. This part looks like it could be fun anyway. Russ
Electronics Forum | Tue Jan 14 15:38:28 EST 2003 | fujispares
Hi, CP3 will have trouble placing 0603 parts - I wouldn`t use a CP3 for these parts - A CP4 will be more suitable. A older CP4 feeder will fit and function on a CP3.
Electronics Forum | Wed Jan 22 14:14:56 EST 2003 | Stephen
Most of the design considerations will be for the wave soldering of the SMT parts. Have you considered selective soldering pallets or masking as an alternative? One problem I have seen with the epoxy process is parts that are high off the board and t
Electronics Forum | Thu Jan 30 12:16:43 EST 2003 | Steve
Can anyone tell me what parts on the pwb should be protected by the conformal coating, and what parts can be free of the coating (such as the areas without components, traces, brides lands)? we were follow MIL standard 2000 and IPC-A-610 class 3. Tha
Electronics Forum | Mon Feb 03 10:03:30 EST 2003 | ksfacinelli
What are people using for re-vacuum sealing of opened parts. The parts of coarse would be baked out prior to sealing. The system should be ESD compliant. Need some help, Kevin
Electronics Forum | Fri Feb 21 12:52:05 EST 2003 | russ
Are you 100% positive that the parts are on before wave? I have found that asking an operator "were they there before?" does not always provide for an accurate answer. how is your handling before and after the wave process? Russ
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Fri Apr 11 00:32:17 EDT 2003 | Joe
Hello, Regarding the failures not showing up at ICT. Failed decoupling caps are notoriously difficult to diagnose within ICT. Check with your test engineering folks and ask them how they've coded for these parts. I doubt that they will say those
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