Electronics Forum | Wed Sep 17 12:30:09 EDT 2003 | russ
I can guarantee that vibrating ovens will be detrimental in double sided reflow for any of the larger parts. I find it interesting about BTU and there "vibrating" oven. I had a couple of these in the early days and they did indeed vibrate. However
Electronics Forum | Wed Sep 24 12:30:20 EDT 2003 | cyber_wolf
Can anyone give a good manufacturer of hand held vacuum pick up tools? I have tried most of the common ones out there.(Vampire,Pen Vac,Selecta)They seem to work OK, but they still lose vacuum and drop parts after a couple seconds. We just got in a ne
Electronics Forum | Sat Sep 27 09:32:36 EDT 2003 | mantis
All, I was wondering what causes the corners of a bga to lift during reflow process.Now just to clarify i have been running this one particular product for 4 years and i have the process and reflow profile down to a tee.But recently i have witnessed
Electronics Forum | Thu Nov 20 09:19:01 EST 2003 | markhoch
What do they say? Not too much as of yet. (I haven't actually recieved them yet.) The parts are being custom made by my customer. I've already bought my stencil, so I'm thinking I'm just going to try and stencil the tacky flux right on the pads and p
Electronics Forum | Mon Dec 22 15:35:18 EST 2003 | davef
Marc: Please be more explicit. * When you say, "parts have a metal shell"; are you talking about the component leads or the component body? What is the metal, what is it appearance, and what are it's implications? * When you say, "the parts have a
Electronics Forum | Tue Jan 06 15:57:30 EST 2004 | dbdavis
Dear Colleagues, I am evaluating the Linear Tech. Corp. LTC1733 MSE Package for use in our SMT Dept.. For this application I will need to consider the possibility that we will be required to repair these devices after some time in the field. My probl
Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint
Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi
Electronics Forum | Wed Mar 24 15:15:35 EST 2004 | davef
I think you can effectively clean under any other low standoff device. It's an issue of surface tension, pressure, and flow rate. DI water is the starting point, but the surface tension of straight DI water makes it difficult to get under low stand
Electronics Forum | Fri Apr 02 15:41:38 EST 2004 | azdback
You may also want to start on the component library. Hypotetically speaking, the GSM shows the component as follows in the component library: One lead to the right, 3 leads to the left. This is the feeder default orientaion and it will be 0 degrees.
Electronics Forum | Wed Apr 07 09:43:55 EDT 2004 | Alan
We currently use the bartector system on our CP6. It has saved us quite a few times with wrong part numbers being loaded on the wrong location. (rework for certain parts would have been a nightmare) It is extremely easy to use. I was not involved
.gif)
.gif)
