Electronics Forum | Wed Aug 20 08:29:13 EDT 2008 | hussman
I guess it depends on the size of the cap. I find that shadowing of other parts is the problem with Tant-caps. Tell the Gurus to stop picking on your Mom.
Electronics Forum | Thu Aug 21 15:41:18 EDT 2008 | dphilbrick
We had the same problem, same brand part. We were running 3 different flavors only had the issue with one reel. Swaped out that reel for another and the problem went away.
Electronics Forum | Thu Aug 28 07:35:19 EDT 2008 | chrispy1963
Thank you to you all. Ive emailed Jim and he replied to me with part numbers, prices and phone numbers and email addresses. Have a great holiday weekend one and all!!!
Electronics Forum | Tue Aug 26 08:40:41 EDT 2008 | wavemasterlarry
If you use a conventional toaster made for bread, youll have to turn it on its side. Most parts stay on in the up right position but when it pops up they all fall off cause the sodder is still flexable. My customer wasn't to happy about that.
Electronics Forum | Mon Aug 25 18:24:25 EDT 2008 | dyoungquist
The problem is occuring on more than one part # of our 0402 components. That is why I am looking at the reflow oven process very closely.
Electronics Forum | Wed Aug 27 15:48:05 EDT 2008 | grics
Again, our paste manufacturer specifies TAL to be 30-60 seconds. Out of curiousity, how would part placement cause de-wetting? I am fairly new to SMT so elaboration would be helpful... Thanks
Electronics Forum | Wed Aug 27 10:35:04 EDT 2008 | evtimov
Hi, also you can check the board design. If always the sme pins are not soldered, a via could be close to the pin and take part of the solder in. Regards, Emil
Electronics Forum | Wed Aug 27 17:21:28 EDT 2008 | vladig
Soory, but I don't understand what you are saying/asking. Parts with Pb-free finish existed in the Pb-Sn world, so what is so special about your QFPs? Vlad www.sentec.ca
Electronics Forum | Wed Aug 27 23:00:55 EDT 2008 | omid_juve
i mean that the parts that we have here is ROHS compliant(pb free)but the process that we have(the type of solder paste & the surface finish of the board has pb in its mixture) this is not the cause of problem ?
Electronics Forum | Tue Sep 02 13:30:11 EDT 2008 | hermes
Try this. Basic reflow profile build up and explanation of its parts: ramp-up, soak or no soak, peak, cooling. Good starting point.
