Electronics Forum: passes (Page 71 of 150)

Tape & Reel machine

Electronics Forum | Wed Feb 06 11:33:18 EST 2008 | Frank

I once worked at a small CM that did this. On the floor we would save the spent tape to be re-used, so the only recurring costs would be the cover tape. Unless it was otherwise damaged the carrier tape was good for a few passes at least. It just h

Inspection Marking after Conformal Coating????

Electronics Forum | Tue Mar 04 10:42:45 EST 2008 | operator

We have a product that requires labeling and serial numbers that obviousely should be put on prior to conformal coating. 1.What kind of labels/ink/sharpe can be used under conformal coating without disolving etc...? We will be using Techspray 2103-1

Prototype SMT & Ltd Prod Line Choices & Advice

Electronics Forum | Mon Mar 17 15:45:59 EDT 2008 | slthomas

Something to consider is the ability to pick from 2mm tape if you're going be placing 0402s. Quads can't really do it (at least they couldn't do it about 6 months ago when we inquired), but you can program two feeder locations for the same feeder and

IC marking unclear after pass reflow

Electronics Forum | Wed Apr 02 09:56:59 EDT 2008 | patsama_n

Every time to create new AOI program we must manual set at bright lighting level for each component. then this case we think the parameter of AOI setting it not concern for this problem due to the golden board that we use to confirm machine before st

What caused this reflow issue?

Electronics Forum | Thu Apr 17 07:54:02 EDT 2008 | davef

Our quality types wouldn't allow: Q16 on "1up good board2.jpg", Q17 on "1up good board.jpg", or Q15 on "1up good board3.jpg". They'd probably pass Q13 on "Q13 next to Q14 no-reflow.jpg", if it wasn't part of a bigger issue. Again, you appear to have

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj

Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C

problem in solderability

Electronics Forum | Wed Sep 10 14:19:51 EDT 2008 | stepheniii

Root cause analysis is simply looking for what caused a problem, then looking for what caused that, and so on, until you reach someone you don't like, or can pass the buck onto. I don't see why Vlad's method is better than tweaking your knobs until y

Inconsistent mounting on TOPAZ-X

Electronics Forum | Mon Nov 17 04:03:08 EST 2008 | griffin

If the whole board is shifted then it must be a problem with the clamping of the fixtrue to the machine or the board to the fixture, or the fiducial reading that is incorrect. Are the fixation of the board to the fixture the same in both programs? A

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 06:02:22 EST 2008 | caerleon

Hi all, I have been in the game for near on 15 years and finally something has stumped me! As this site has always provided a wealth of knowledge and at times some amusement I have decided to post it here. Ok. My company uses a test method on an Om

BGA soldering problems

Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty

Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p


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