Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal
Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin
Electronics Forum | Thu Apr 26 18:39:45 EDT 2001 | jagman
I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepabl
Electronics Forum | Thu Dec 23 15:29:48 EST 1999 | Glen Robertson
Mike - I'm not in the EMS business, but I suspect most of them are very reluctant to reveal much about their quoting process. You might want to try some of the third-party data suppliers like Ceeris (www.ceeris.com), and you can also check the C
Electronics Forum | Tue Dec 07 14:23:34 EST 1999 | JAX
Vahid, What type of error are you talking about? If you mean accuracy I would stick to round fiducials. As far as machines, the only question is about active component placement. For passive components Fuji(CP-series) is the way to go. O
Electronics Forum | Wed Nov 17 11:36:16 EST 1999 | JAX
If this is going to be the beginning of a lucrative and fast growing company you probably want to go with Fuji ( CP series ) , it's by far the fastest and longest lasting. If money is a big issue at this time and you want to get the biggest bang for
Electronics Forum | Wed Aug 18 15:56:20 EDT 1999 | david dougherty
Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf I am c
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
Electronics Forum | Tue Mar 16 03:16:18 EST 1999 | Scott Davies
| | Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probab
Electronics Forum | Wed Mar 04 08:59:03 EST 1998 | Steve Gregory
Hello All, Just as a side note, we've got one in use in the PCMCIA line at the Technological Advancement Center lines here at NEPCON West 98...after watching it at work, I gotta say, I'm impressed! We're using it to inspect BGA, Micro BGA, 15.7
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
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