Electronics Forum | Fri Oct 07 15:49:58 EDT 2005 | Amol
Hi, Can anyone suggest what solvents are the best for manual stencil cleaning?? we are currently using alcohol wipes, but the fine pitch apertures still have solder paste stuck in between them. We should ideallyhave a stencil cleaner, but until that
Electronics Forum | Mon Oct 17 11:16:09 EDT 2005 | slthomas
There are a lot of things that might affect your cleaning efficiency. Paste type (no clean or w/s?), cleaning chemistry, aperture aspect ratio (aperture width/stencil thickness), "linty" wipes, etc. Another thing you need to look at is the frequency
Electronics Forum | Mon Oct 24 11:00:11 EDT 2005 | rlackey
You can't really use a pasted board to troubleshoot the program as any components not on target simply slide off with machine vibration and movement as they won't be held by the solder paste. Whereas on double sided sticky tape they remain in place
Electronics Forum | Mon Nov 21 17:55:19 EST 2005 | slthomas
"...Moonman is a pretentious wannabe in the industry. If you look through the archives here you'll see that nothing could be further from the truth. His contributions on the past were pretty friggin' spot on. However, he no longer posts anything t
Electronics Forum | Fri Jun 30 10:51:36 EDT 2006 | samir
Indium Pb paste has always been great but the flux tends to implode on the BGA's (despite many different profile strategies). The Indium Pb-Free is horrible...horrible, and have been kicked out of my lead-free eval. PS-I went to Moonman/Guru link a
Electronics Forum | Tue Nov 01 09:21:39 EST 2005 | jdengler
I've never heard of this before. If your solder paste is at the correct temperature, and your process is under control you should have an acceptable print the first time. This sounds like a terrible waste on time and paste. Set up a DOE to prove tha
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Tue Nov 22 08:11:36 EST 2005 | davef
It sounds like you're exhausing your flux activity on this component proir to reflow. We'd start with the reflow recipe suggested by your paste supplier. If the component lead doesn't flow well try: * Raising the peak temperature in 5*C increments.
Electronics Forum | Wed Nov 23 00:22:30 EST 2005 | mskler
Thanx for your only reply!! I already increased temprature now its actualy on board is 240*c. I would like to discuss one more thing if I go for lead free solder paste & using some components wich are not lead free then what will be the result. Has a
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