Electronics Forum | Fri Jun 05 03:59:17 EDT 2015 | buckcho
Hello, I also have a sample, but my lines are very busy. As soon as I test it I will post some results here. I am trying currently to see how much money is this paste going to save to the production, just from special deliveries (special packaging fo
Electronics Forum | Wed Oct 07 13:15:06 EDT 2015 | markhoch
You can most certainly use the same reflow oven for both leaded and lead-free pastes. Obviously your thermal profiles will be different, as the lead-free paste should have a higher reflow temp. As long as your oven has adequate exhaust and flux manag
Electronics Forum | Wed Jan 27 13:15:41 EST 2016 | cyber_wolf
You can buy an awful lot of stencils for 200K. Unless you are running "special case" products I'm not sure how the cost can be justified. We get our stencils next day with no added charge. The MY600 must use specified paste chemistries that are no
Electronics Forum | Mon May 02 12:24:11 EDT 2016 | adamjs
One word: Dispense your paste That's three words! Unfortunately the board has nine LGA components. Stenciling is the only way to get the required consistency in deposit shape and volume. If the board were all passives+QFN I would definitely use a
Electronics Forum | Mon Jul 11 10:59:50 EDT 2016 | mnorthey
Other problems on previous machines that we have experienced is that there was not enough board support under the panel or that the panel thickness was inaccurate. Both situations can cause parts to bounce off the PCB or not to be pushed into the pas
Electronics Forum | Thu Oct 20 09:58:54 EDT 2016 | davef
You say, "... re-flow profile temperature, the peak temperature of a component was on 253*C." Questions are: * I assume that was the temperature of the component body. What was the temperature of the solder ball? * How does the temperature on the pr
Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto
If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci
Electronics Forum | Thu Apr 06 05:20:05 EDT 2017 | pavel_murtishev
Good afternoon, I am looking for experienced CAM350 users here. I might have found a bug in DFMStream paste mask checks. If you have experience with CAM350, please reply and I will describe the issue. Any input would be really appreciated. Regards
Electronics Forum | Mon Jun 05 14:37:55 EDT 2017 | stevezeva
At a past employer we stacked caps and resistors quite regularly. As some have suggested a dispensable paste was used and dispensed by hand and then the stack was placed. At first it was placed by hand, but then we were able to program our Mydata to
Electronics Forum | Wed Jun 14 09:34:25 EDT 2017 | cyber_wolf
In my experience there is no need for wet wiping stencils. We run 0201'and micro BGA's daily with no issues. If you are having paste release issues, I would be looking at other things. Aperture area aspect ratio, aperture design, land design, sold
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