Electronics Forum | Tue Sep 10 22:29:01 EDT 2002 | scottefiske
Many times after initially cleaning in the solvents recommended by the paste/material manufacturer, a light white haze may still be visable...try using a soft bristle brush to remove the remaining residues. By this time the residues that remain will
Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp
Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.
Electronics Forum | Sat Sep 14 20:42:48 EDT 2002 | kenbliss
Hi Scott Thanks for your comments, you stated "The highest attributer was clogging apertures in fine pitch, resistor networks, and BGA, Micro BGA areas" was this do just to the size of the aperture or bad or old paste or debris from inadequate clean
Electronics Forum | Tue Sep 17 10:01:56 EDT 2002 | yngwie
Thanx for the proposal...but Dave I'm not able to link to PCD's Sites past issues 11/98, that you were suggesting. Is there anyway that I can get a copy of the said articles ? Appreciate your help and thank you in advance... cheers.. yngwie
Electronics Forum | Wed Oct 02 00:08:26 EDT 2002 | praveen
Hi, We are using chip components with Silver Pladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how ti improve the solder wetting for those components. Thanks,
Electronics Forum | Wed Oct 02 00:08:39 EDT 2002 | praveen
Hi, We are using chip components with Silver Paladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how to improve the solder wetting for those components. Thanks,
Electronics Forum | Sat Oct 12 05:05:09 EDT 2002 | Kenture
I run 0201 on a 5 mils stencil with openting of 15X12 and did not have any issue. The major concern is the placement and CP643 did very good job. Type 3 solder pastes was used. Good luck.
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Thu Oct 24 15:02:16 EDT 2002 | seand
Hello Yannick, Have you brought this concern up with your supplier? I would recommend speaking with your flux and paste provider to gain additional insight and recommendations for resolving the concern. Good luck, Sean D.
Electronics Forum | Fri Oct 25 04:13:33 EDT 2002 | kcngoi
Hi, No clean mean is no need to clean. Of couse if you usin incompatibility solvent to clean, the white residue will appear. If cleaning is needed, source the suitable solvent and this always suggested by your solder paste supplier. regards
