Electronics Forum | Thu Mar 19 11:44:03 EDT 2020 | svajunasastrauskas
Hello, can someone share good practise how to calculate how many percent solder paste can be applied on solder mask for better solderability (by increasing stencil aperture). In eg, aperture is increased 30 percent, could it be more? Where find this
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Fri Mar 20 09:29:27 EDT 2020 | slthomas
If you just want a little more paste and don't care where it ends up I guess percentage is OK, but if you're trying control where it ends up it makes sense to specify how far, and in which direction(s).
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Thu Apr 30 23:28:17 EDT 2020 | SMTA-Davandran
Do considering AR and 5 balls rule during designing stencil aperture. it give better paste release. Aperture redesigning need to look into symptom that we are seeing on AOI. It will be given us idea hows to improve aperture design to improve SMT firs
Electronics Forum | Fri May 29 17:06:22 EDT 2020 | naranjafresa
Thanks DWL! As you say, i am dealing with quality auditors. I will follow your advice. I'll ask for a statement from the manufacturer. Thanks a lot
Electronics Forum | Sat May 30 11:42:44 EDT 2020 | stephendo
At the same time ask for the technical data sheet and the Safety Data Sheet. You don't know what other auditors you may have to deal with in the future. And someone should have all the SDS's in a binder for all the chemicals that you use.
Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw
I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
Electronics Forum | Sat Jun 27 04:14:01 EDT 2020 | rsatmech
Hi Indhu, Kindly check the data sheet of the part for Reflow details and what type of past is been used for Reflow?
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