Electronics Forum | Thu Dec 09 14:42:28 EST 2021 | emeto
People that measure, say 4 symmetrical points() and one in the center to get the full picture. I personally see it as a NO value added activity. If stencil changes performance - replace it.
Electronics Forum | Thu Dec 09 21:46:22 EST 2021 | dwl
Totally agree with Evtimov. Let the SPI be the judge, as long as your getting good prints, your stencil is fine. I had a colleague cut the mesh on one side of a stencil and it still printed fine. This was proof to management that measuring tension w
Electronics Forum | Fri Dec 10 02:42:58 EST 2021 | hello112
SMT stencil standard: measure the four corners and the middle, target value is 26N/CM or more
Electronics Forum | Fri Jan 14 22:07:19 EST 2022 | mihai_voivod
Hi Thomas, May I ask how much paste/solder do you put on this part?
Electronics Forum | Thu Jan 20 13:56:51 EST 2022 | stivais
For me it seems that the board is already assembled & soldered. Before assembling the board had been (poorly) washed (misprint perhaps) and the spots are just melted solder paste. Aren't those solder balls in the grooves between the pads and solder
Electronics Forum | Wed Feb 02 21:32:13 EST 2022 | chuckphd53
The rotation is a fixed parameter..... and of the 9 parts, randomly it will skew the part, could be one or more... I was thinking maybe the solder paste was too dry and during the LIFT after placement it would blow the part sideways.. Yes I am on a
Electronics Forum | Thu Feb 03 20:43:09 EST 2022 | chuckphd53
Yes, it is being pushed into the paste, did a slow place motion and you can see the nozzle press (spring) as it reaches the board height... the nozzle is black, and I tried a new nozzle also... good thoughts tho.... much apreciate the help...
Electronics Forum | Thu Feb 24 20:13:22 EST 2022 | dwl
They don't look that bad, especially for SN100. There is evidence of wetting on the toe and the paste on the pad seems to have reflowed properly. What does the heal look like? That's the more critical part of the solder joint for Gull leaded parts.
Electronics Forum | Thu Mar 03 14:01:16 EST 2022 | chris007
Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA
Electronics Forum | Thu Apr 07 14:05:53 EDT 2022 | SMTA-69080803
@cbart It's a mid-volume product and as I said, there are several boards (slightly different layouts) using the same component. When you say ISI, do you mean connectors? can you give me an example of what you used in the past?
