Electronics Forum | Sun Feb 24 13:52:47 EST 2002 | bentzen
Hi Armin Printing equipment can be divided into two main groups; In-line and off-line. For "small" production sites an off-line screen printer should be adequate but for high out-put placement lines, where the product cycle-time is short, an in-line
Electronics Forum | Thu Feb 28 20:55:31 EST 2002 | djarvis
Hi Nightbull, I'm with Dave. Don't see the need. Good stencil, good operator, reasonable machine with at least manual vision alignment, good set up, solder paste that satisfies you and the customer, regular maintenance, and how can you go wrong? As
Electronics Forum | Tue Mar 19 07:55:19 EST 2002 | jax
It might just be me, I have been known to loose my mind, but I don't believe I understand the question. If your asking for an idea of how much paste volume you should have for this part, I think its a little late. You already have the stencil so your
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Wed May 22 02:35:26 EDT 2002 | ianchan
hussman, hi, mebbe we get the stencil fab house guys who spend more time in the workshop making more stencils = more revenue, whereas your stencil fab house is more learned and refined? we make it a point to use an inhouse MS-Excel format to key in
Electronics Forum | Fri May 31 03:45:54 EDT 2002 | robbied
The Flextac micro stencils I mentioned are not metal, but rather laser cut polymer, so not as easily damaged. As for cost, Even if you only re-use them 5 times and not the 10 that another company I know does, they only cost around �36 for a pack of t
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Wed Jun 05 15:09:44 EDT 2002 | cyber_wolf
I have seen this happen before it has been my experience that even one tiny sphere of solder form your solder paste will melt and spread out on your gold fingers. The particles are so small that they are not visible to the naked eye. If operators ha
Electronics Forum | Wed Jun 12 08:24:03 EDT 2002 | davef
Tough. 0402 capacitors are more prone to tomb stoning than resistors. Tailor your process to the 0402 and let the other stuff fall where it falls. Search the fine SMTnet archives for discussion on tomb stoning. Consider: * Changing paste. * Apply
