Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan
Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w
Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef
Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil
Electronics Forum | Thu Feb 06 13:57:01 EST 2003 | D. Brian Davis
I need some feedback on aqueous cleaners. We currently use a Unit Design batch cleaner. We will be looking to upgrade our board washing process and batch sizes in the near future. I am looking for user info. on the advantages/disadvantages to using b
Electronics Forum | Tue Feb 11 16:27:18 EST 2003 | Chad
Currently we hand-assemble all prototypes, usually quantities less than ten. I mentioned the 5 to 50 number because a client will occasionally request more than ten, which has been handled previously by using an outside contract manufacturer (we are
Electronics Forum | Thu Feb 13 11:42:36 EST 2003 | vortex
We currently screen print all of our adhesive applications and generally have favorable results. The adhesive we use is: Heraeus , P/N 250 GM Prod/N PD955PR We print this on three different screen printers, Dek 265 Horizon, Fuji GSP-II and MPM-30
Electronics Forum | Wed Feb 19 17:27:14 EST 2003 | ryanm
I have a problem with 0805 caps and resistors randomly falling off in the wave solder machine. Currently I am placing single dots of epoxy under 0805's. The single dot is flattened down so I know that the part was placed. In the past when we double
Electronics Forum | Mon Feb 24 15:14:21 EST 2003 | blnorman
Having worked with adhesives for years, the first thing to look at if there is a failure of this type is surface contamination. The subject has been discussed here also. A structural adhesive will increase in strength with a "hotter" cure. We also
Electronics Forum | Thu Feb 27 13:50:55 EST 2003 | Matt Kehoe
We use an Aqueous Technologies Millennium III closed loop system. The footprint is no more than 12-13 feet. We wash water soluble solder paste residue with excellent results however, due to the nature of our solid solder deposit process, we are washi
Electronics Forum | Thu Feb 27 15:33:37 EST 2003 | James
We need to use water-soluble paste due to cleanliness requirements. No-clean does not mean No-contamination. I have talked to a lot of people who use no-clean and they still wash their boards except now they have to use chemicals to do it. So, you
