Electronics Forum: past (Page 836 of 992)

Outgoing QC Measurements for Board Operations

Electronics Forum | Tue Oct 21 10:24:54 EDT 2003 | russ

Whoever established the PPM rates should tell you what it is covering (solder joints/assemblies) PPM is nothing more than a ratio. Determining quality levels is really up to you/company and how you want to measure your quality. This can be anything

Dry Box

Electronics Forum | Mon Nov 03 12:15:12 EST 2003 | fmonette

Hi John, There are different types of cabinets available with desiccants or Nitrogen/dry air. The best choice depends on many factors in your production environment. The most important consideration for level 4 components, is to make sure that your

Track Repairs

Electronics Forum | Sun Nov 30 08:53:15 EST 2003 | davef

IPC-6012A finds "circuit repairs" as acceptable in Class 1, 2, and 3 only "As agreed by user and supplier." So, it is your call, basically. Generally these repairs, if done properly, are reliable. See IPC-7721, 5.2.3, for conductor repair by welding

need all

Electronics Forum | Mon Dec 22 18:10:09 EST 2003 | odody

Tony, Be very careful with used equipment dealers. Make suer they have a comprehensive remanufacturing plan for the equipment, that it is calibrated the same as it would be from the OEM, and that the staff that will install and maintain it are fami

No-Lead solder defect - No solder on pads

Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel

Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o

To overcome human problem

Electronics Forum | Sat Dec 20 02:35:27 EST 2003 | tommy

My boss who always like to read smt related mag,pick up what he can or don't understand from the article and blame all quality issue on engineering. We are seeing solder paste residue all over Juki printer equipment,on the floor,etc.This is mainly du

QFP soldering issue

Electronics Forum | Wed Jan 14 10:07:38 EST 2004 | Patrick

More on QFP soldering issue as per Paul f original e-mail. 1. Problems occured on different PCB's, on different lines using different equipment 2. Flux residue is common in the dimple on the solder. 3. The fault occurred using both "Kester 265" & "Al

Wavesoldering Preheat

Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude

What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co

Zones Temperature for ReflowOven

Electronics Forum | Mon Jan 26 20:11:02 EST 2004 | davef

The primary driver to the set points for your oven is not the board or the number of zones in your oven. It's your paste. If you need a "ball park" guesstimate as a starting point, your equipment supplier is probably the best place to start. So fo

Cleaner device for PCB

Electronics Forum | Wed Feb 04 13:12:35 EST 2004 | Debbie

Hi Rick, Cleaning No Cleans is becoming more of a norm. It is true that changing to a OA flux/paste would be a easier process to control from a cleaning standpoint. A water soluble process will cost a great deal less as well. However, if your pro


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