Electronics Forum | Fri Oct 11 03:06:00 EDT 2019 | bukas
Hello Dekhead, it is a constant offset, like 0.5 mm to right when machine prints away from operator. When print goes towards the operator there is no offset. I swapped X5 and X6 cards with spares I got but still same result . I set the program to hav
Electronics Forum | Wed Jul 29 10:39:57 EDT 1998 | Ryan Jennens
Howdy all- Does anybody have any experience with solid solder deposits as an alternative to paste deposits? I have heard many good things, but do board fabricators have the technology to do this? Where can I get more information on how to try
Electronics Forum | Sun Jan 28 21:50:22 EST 2001 | Dreamsniper
Hi Adrian, If you do a "squeegee snap off" during solder paste printing...the result would be a very thick solder paste deposition. I think the correct term is stencil snap off or people say it "snap off distance". =)
Electronics Forum | Thu Feb 28 11:37:28 EST 2002 | Nightbull
I would like to know if there are any IPC standards or anything remotely referring to having a Solder Paste Deposition tester in house to check the printing process. I have an interesting situation. Any help would be appreciated.
Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont
Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD
Electronics Forum | Wed Jan 31 17:37:23 EST 2007 | GS
Hi, as for IPC-7095, in case of BGA, other important value to inspect/measure (3D) is the volume of paste deposit, mainly when mounting Ceramic BGAs. Regards...GS
Electronics Forum | Wed Feb 24 01:04:08 EST 2010 | dashley
Is it necessary, or beneficial to apply solder paste on the PCB pads for QFN rework? It seems that using micro stencils is not the best approach. Any guidelines or suggestions available for paste deposition techniques?
Electronics Forum | Mon Oct 12 14:30:58 EDT 2015 | duchoang
Hello Eniac, 1/- Insufficient solder paste, check your print (Printer/Stencil). 2/- If you've got good paste deposit, that could be contaminated pads causing poor solderability. Good luck.
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
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