Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
Electronics Forum | Thu Oct 26 16:38:08 EDT 2000 | Philip A. Reyes
Hi Sir Charles! Good Day! I hope you can help me about my queries. 1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych
Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
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