Electronics Forum | Tue May 12 10:02:52 EDT 2009 | dwl
I am trying to develop a process for building high environmental temperature PCBs (150-225C) specifically for down hole applications. I'm specifying an evaluation board and was thinking about using polyimide PCBs with Sn05Pb92.5Ag2.5 solder. What so
Electronics Forum | Thu May 14 13:25:14 EDT 2009 | cyber_wolf
Me thinks generic profile + desktop and laptop computer boards= not happy time. Attach thermo-couple to appropriate location on said part/pcb. Make profile same as solder manufacturer / component manufacturer spec. There is no magic heater set poin
Electronics Forum | Tue May 19 16:33:56 EDT 2009 | stimpk
My 1st question before I can give you an idea or for one even post an idea. Unless I am reading this wrong , you are doing board repair/refurb? You are looking for an inexpensive way to do this repair while at the same time acheieving a proper reflo
Electronics Forum | Mon May 25 04:51:44 EDT 2009 | microdot
hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small pcb. the picture i have enclosed is used to remove the but when we tried to solder the chip using the same profile..it didnt work. Can anybody suggest
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Mon May 25 20:17:56 EDT 2009 | paligora
Hi , we have problems with the pick & place nozzle when assembling data switches on the PCB. The SMT switches have top surface with diameter of 2.6mm and our supplier is suggesting that if we need to replace the current nozzle which has oval suction
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135
On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you
Electronics Forum | Tue Jul 07 15:02:48 EDT 2009 | snsmt
Hello everyone, I have a question regarding rework. How do you guys rework QFPs (lead free)? The only method that we are currently doing is using a heat gun. We are heating up the bottom of the PCB (approx. 2") away from the bottom of the
Electronics Forum | Wed Jul 29 07:06:44 EDT 2009 | patrickbruneel
Deni, This looks more like webbing and not flux residue. Webbing is caused by not enough flux to protect the surface resulting in oxide webs sticking to the board surface. The insufficient flux can be caused by: - Weak flux foam head - Air knife p
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