Electronics Forum: physical (Page 21 of 40)

Ready, Shoot, Aim!!!!

Electronics Forum | Fri Mar 16 07:40:16 EST 2001 | C. Robert Nelms

David Fish alerted me to this dialogue, after visiting my web site. I am one of the "anal" consultants that are trying to help people "learn from things that go wrong." I don't know where to start. Perhaps by asking you not to lump all of us toget

Solid Solder Deposit

Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan

Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t

help our school

Electronics Forum | Tue Jun 05 06:45:46 EDT 2001 | jackofalltrades

I am not in your area to provide physical assistance, but I'm full of advice. Keep in mind you get what you pay for. One thing you can do is what you have done here, watch this forum and others like it. You will see where the short comings are. Obvio

help our school

Electronics Forum | Thu Jun 14 23:34:43 EDT 2001 | uk boy

I studied in the UK, so I am not sure about the US educational system. My mate studied at the Illinois Institute of Technology and he is a much smarter than me so I guess you Yanks are doing something right! ;-) I agree mostly with davef. Theory

301-00030 CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF TOLC-140-3

Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax

I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top

Re: Noclean soldering to gold

Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko

Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you

Re: Heat Dissipation Problem

Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko

| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a

Re: Mydata TP-18, can she place 0402's

Electronics Forum | Fri Aug 20 12:44:27 EDT 1999 | ScottM

| IF anyone is placing 0402's with the Mydata tp-18 I would like to here how reliable it is(with these little buggers). | | | Thanks | | MD Cox | I've been placing them with a TP9-2U. You need to buy a new tip and a new feeder to accept taped co

Re: ESD Tote questions

Electronics Forum | Thu Aug 19 10:50:51 EDT 1999 | John Thorup

| I have a few general ESD tote questions: | | 1) For purposes of transporting within a factory, are tops necessary to the tote containers? | | 2) Are there any other colors beside black that are conductive? | | Thanks, | Mike Demos. Sort of depen

Absolutely, no glue, no fuss.

Electronics Forum | Tue Apr 06 09:50:58 EDT 1999 | Justin Medernach

| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | I use a double sided reflow process all day, everyday. I've hung QFP240s with embedded heat sinks and they don't fall off. Yei


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