Electronics Forum: physical (Page 31 of 41)

Warming up solder paste at start of days production

Electronics Forum | Wed Jul 28 07:59:50 EDT 2004 | cyber_wolf

Ken, With all due respect: Surface mount is surface mount. Whether you are placing 0201's, or PLCC84's the basic concept is the same. So I would surely hope that for the most part my process is transferable. I guess I was too broad when I said "we n

Philips CSM 84VZ

Electronics Forum | Sun Mar 06 17:10:41 EST 2005 | Darby

The manual gives you a fair idea here. Reference for the Yamaha manual is THE6006 - I don't know if Philips is the same. Cause is either overload or overcurrent. The manual suggests that you can tweak the trimmers on the driver board but these are us

Acceptable standards

Electronics Forum | Fri May 27 08:36:26 EDT 2005 | K

Thanks for your replies, to go a little deeper..... The sample run I chose was a very small run.... 3 PCB's, 340 parts in total required for the 3 boards. Machine mischuck info gave a total of 360 parts used, 20 lost to various reasons, recognition/

MPM forgets fiducials

Electronics Forum | Thu Jun 23 21:04:04 EDT 2005 | darby

If you have concluded that it is not a file storage problem you may wish to consider - When setting up a job the camera can move to virtually any position. This does not mean that the actuators on the stencil or board have enough travel to align the

Very fishy missing solder paste issue

Electronics Forum | Wed Jul 20 14:56:29 EDT 2005 | CLampron

The mount plane is not the same every time. Our machines are conveyorized and the bottom rail is fixed so the mount plane does change with the board thickness. The stand alone table has a V notch for holding the board with the flat edge on the bottom

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel

Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine

Pb % contaminant allowed in Pb/Free Solder

Electronics Forum | Sat Nov 12 07:00:40 EST 2005 | davef

Those limits of allowable impurities have been set over many years of practical experience. People area talking about lead contamination of lead-free solder connections, but I can't find specific numbers in my notes. Places to start are: * One of T

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

Juki vs Mydata... again...

Electronics Forum | Tue May 02 23:34:26 EDT 2006 | Frank

The 2060RE model that I have can do an 18"x20" board. I think the Mydata can do larger. Juki did tell me that next year they will release a machine that will do larger boards but didn't specify on how big. The 2060RE can do 0201 up to 74mm square

Cleaning Paste from 2nd Side Print

Electronics Forum | Wed Nov 01 11:30:49 EST 2006 | slthomas

Dave, your points certainly have merit and I wouldn't make a habit out of that method. We did it only because there were a lot of parts dependant upon chipbonder and we didn't think they'd all survive an ultrasonic cleaning, functionally or physicall


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