Electronics Forum: pick (Page 86 of 397)

Quad 4c LAE

Electronics Forum | Wed Apr 11 00:40:19 EDT 2012 | ngineer

I have a problem setting up the LAE on my Quad 4c. I set it up for 0805, and it seems to work, although it rejects a lot of parts, at least it places "most" of them. I tried setting up on a soic14, and could not get even one to pass. I believe I h

Yamaha YM84 (Phillips CSM84) Optimisation

Electronics Forum | Tue Dec 21 16:17:42 EST 1999 | Paul Isaacs

Does anyone know of effective pick and placement optimisation tools for the Yamaha YM84 (Phillips CSM84). We are small manufacturers that have 2 YM84 machines, 1 being a triple pick machine for placing jelly beans and the other for placing IC's. We a

Re: Not picking from MTU

Electronics Forum | Tue Nov 10 12:06:59 EST 1998 | Steve Herring

Larry, We place QFP240's all the time with our 2 IP-3's. If you provide your e-mail or fax number, I can send you the PD that we use for our QFP's. Steve | Here is a good one for ya. Our IP3's MTU will not pick QFP240's out of cavities, 10, 12,

Re: Not picking from MTU

Electronics Forum | Thu Nov 12 18:39:10 EST 1998 | Phillipf fHunter

| Here is a good one for ya. Our IP3's MTU will not pick QFP240's out of cavities, 10, 12, 13, 15. This is a 3X8 tray. The listed cavities are also the closed cavities that are used for tray eject. There is plenty of vaccum, the nozzle comes down

Package tilting during assemly

Electronics Forum | Tue Oct 20 03:22:52 EDT 1998 | Viswanath Valluri

Hello : Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. My qu

Re: Package tilting during assemly

Electronics Forum | Fri Oct 23 15:19:38 EDT 1998 | Dave f

| Hello : | Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. M

Connector Removal

Electronics Forum | Wed May 29 15:29:41 EDT 2002 | zanolli

Hello Peterson, If the contact tails protruded enough on the underside of the PCB, then you could do a "reverse" press fit. I do not believe that to be the case with the VHDM. Placement equipment is out of my bailiwick but; Usually small SMT connec

Pick Up Error

Electronics Forum | Thu Aug 05 20:33:48 EDT 2004 | Dhanish

The machine type is Fuji CP6.We have major issues with Network Resistor placement.The equipment guys often feedback there is a problem with nozzle and feeders.What will happened to the part if the Thickness data in the Part Data does not match the Pa

Pick and Place Machine Validation

Electronics Forum | Mon Mar 14 11:41:39 EST 2005 | pjc

This company can come in to your facility with equipment to measure the pick-&-place machine's accuracy and repeatability of placements in X-Y-Theta: in North America, http://americas.cetaq.com/index.php?lang=en in Europe, http://www.cetaq.com/

Optimizers

Electronics Forum | Thu Jun 23 20:09:03 EDT 2005 | Stefan

Optimizers for pick and place machines are very specific for the type and model of the machine you are using. A chip-shooter will run at optimal speed with the same type of nozzle and minimal table movement. Most X-Y tables have a faster X-axis than


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