Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Sat Oct 10 09:01:46 EDT 1998 | Al Carrillo
| we currently have a siplace line(80s/f) and are inhereting a fuji line from another site. I need an objective comparison between the two. What are the strengths and weaknesses of the fuji with regard to programming, operating and maintenance. any c
Electronics Forum | Sat Oct 10 18:35:18 EDT 1998 | phillip hunter
| we currently have a siplace line(80s/f) and are inhereting a fuji line from another site. I need an objective comparison between the two. What are the strengths and weaknesses of the fuji with regard to programming, operating and maintenance. any c
Electronics Forum | Wed Sep 16 10:35:45 EDT 1998 | John McMasters
| | Has anyone used Fuji's rubber tip nozzles for the IP3? Are they O-ring type or suction cup? I'm having trouble picking up Ompacs due to the top of the part not consistently being flat. Any actual experience with these $1100 nozzles would be app
Electronics Forum | Mon Sep 14 07:58:36 EDT 1998 | Earl Moon
| Jon: | What stimulated this? It's okay to pick on Earl, but explain who is placing .008" pitch. Sounds like the olde hybrid guys? | Always looking for cheap equipment to do hi-rel production. | Wayne Wayne, I resemble that remark. Jon, That's a
Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting
hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Fri Sep 04 15:55:28 EDT 1998 | Dan Lambert
| Has anyone been able to link a Mydata with the Pads Software. The book say's it can not be done but someone told you can?????? Could someone put me on the right road. | Thank You | John Kirby John, I work for Aegis Industrial Software and we develo
Electronics Forum | Wed Sep 02 11:52:40 EDT 1998 | Dick Casagrande
We are investigating equipment for a new SMT line. We are an OEM doing thru hole assembly and now must decide whether to do SM assembly in house or sub-contract out. We are a low volume/high board mix company. Our boards are mixed tech with SM on bot
