Electronics Forum | Tue Dec 07 07:59:36 EST 2021 | jineshjpr
Hi Evtimov, Thanks for your response - Coverage of Paste on the pad is 85 % (By considering window & outer area), Let me revert back after PAD design vs Recommendation verification.
Electronics Forum | Sun Jan 13 19:44:02 EST 2008 | grantp
Hi, We need to solder a USB plug onto a PCB in our SMT machines, and this is the same type of plug you see on USB storage devices. It's a very flat connector with 4 SMT pins, however the hard part is the bottom of the connectors is the same level
Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich
The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the
Electronics Forum | Thu Jan 03 14:01:24 EST 2008 | fsw
Davef, thnx for your reply. Sorry, forgot to clarify "our normal soldering process". We use standard Sn/Pb & SAC305 for our non RoHS & RoHS requirements. We only have a "No Clean" process, no aqueous flux is used. Hence our flux will be mild. As susp
Electronics Forum | Tue Mar 27 01:46:59 EDT 2018 | buckcho
Hello, can you tell me your SPI machine brand? Some brands have Bare board teaching for getting the best data when measuring paste. Even then it is normal to have more paste than 100%. So you can check your average and see if you are getting this on
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Tue Dec 07 17:25:28 EST 2021 | stephendo
How fast do you use your OSP boards? We don't use them but if we did I would want to try and use them the same day we open them. They are cheap but do not store well. Tin/Lead paste spreads much better than ROHS paste. If you can not always reflow
Electronics Forum | Thu Mar 04 14:20:41 EST 2004 | Robert
Another question... I use 500gm jars of Kester 256. After a job is complete the used solder is collected and put back into the jar. Generally while a job is run, the jar and used paste could be left out/open for up to 4 hours. A piece of seran wrap i
Electronics Forum | Fri May 18 10:45:43 EDT 2012 | brotakul
Hello CAPSE, The link you posted is not available.
Electronics Forum | Sat May 19 13:42:31 EDT 2012 | brotakul
Thank you, interesting reading.
