Electronics Forum: pin (Page 156 of 229)

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Wed Feb 14 02:06:05 EST 2018 | ameenullakhan

Hi Evitmov, Thanks for your valuable suggestion. we have used RTS profile. And profiles with an average soak and reflow time.:( Those profile didn't help us so much. It at later stage we have adopted to this hot soak profile. There is one partic

Siemens HS180 Vision System placing compinents with PCB

Electronics Forum | Wed Jan 17 05:58:45 EST 2018 | awelektronik

Hi Evtimov, no, i have no possibilities to change the Light. My Camera knows only on and off. The PCB-Solder resist looks in that IR-Light whyte like the CE-Symbol of the picture i post in my first message. The Pins with gold looks the same. Its an

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 04:40:15 EDT 2018 | rob

I've seen them down at 2 metres in the past, but usually only 4 zone. from memory Electrovert used to do a small 5 zone with pin chain - Infraflow 500 or something. To be fair, even small one line CEMs usually have a decent oven as you need to be a

Pick Place Programmer

Electronics Forum | Sat Jun 16 19:51:39 EDT 2018 | reckless

I have a small 5mmx5mm 32 pin QFN I need to program and want to find a way to do it automatically. Companies like Xeltek charge $100,000 for an automated programmer and I think it can be done with a regular pick and place machine by placing QFN into

Solder Ball Attach (BGA)

Electronics Forum | Fri Sep 28 01:47:46 EDT 2018 | netvicher123

The followings may be the factors from your description: 1. chain speed and motor speed? 2. is the tin content even? (more or less on one side, or thickness of steel mesh, size of opening) 3. Is there any exception in the pin? 4. is there any level

Selective Gold Plating

Electronics Forum | Mon Sep 24 22:56:52 EDT 2018 | sarason

IF you are wanting to do to this you are to late in the process. The gold is usually applied after the copper etching of the multilayer sandwich. The edge is extended beyong the board edge and the all pins are connected together with a bussbar. The b

Tooling hole to conductor pattern registration specification

Electronics Forum | Tue Mar 05 11:08:31 EST 2019 | mrk

Hi all, We have an assembly which features non-plated tooling holes used to align the board in a bed of nails style test fixture. This assembly is rather small, and as such, the test points are pretty small as well. We have found that some variation

QFN DROP DURING 2ND TIME REFLOW SOLDERING

Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob

You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl

Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer

Looking for trays to lay boards on in reflow oven

Electronics Forum | Mon Jun 10 10:23:47 EDT 2019 | don_julio

We started getting better reflow after rotating the pcb to locate the greater mass closer to the center of the oven. However we still leave space between panels on the conveyor to achieve a better reflow. This costs us production time. I'm simply lo


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