As a high precision multi-functional component placer equipped with a high precision force control head based on the SM421 platform,the SM451 applies linear scale to the X-Y axes to improve the placement accuracy. Basically, the machine handles compo
Industry News | 2015-02-10 17:39:13.0
SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 14-16, 2015 at the Eastin Hotel in Penang, Malaysia.
Holder pip_change IC-head f. X4 w. MTC
Mirae MX200 MX400 C TYPE 8*2MM ORIGINAL FEEDER FOR SALE Mirae MX200 MX400 C TYPE 8*2MM ORIGINAL FEEDER FOR SALE Email:firstname.lastname@example.org Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com Philips / PHILIPS FCM2 sli
Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
Technical Library | 2010-09-16 18:45:06.0
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de
00367071-02 Adapter cable 1 SUB-D pin - 2 SUB-D sock 03048638-02 BOX 03048639-02 MAGAZINE FOR NOZZLE P+P / S-F-D 03048676-02 MAGAZINE COMP. /2 NOZZLES P+P / S-F-D 03048803-02 reject device nozzle changer 03048851-01 CABLE:VALVE
03048851-01 CABLE:VALVE LIFT.TABLE UP CONV.BOARD 03048852-01 CABLE:VALVE LIFT.TABLE DOWN CONV.BOARD 03048854-02 NOZZLE TYPE 1005 COMPL. ESD 03048858-01 El.-Mag.-Valve CPE10-M1BH-5/3G-QS6-B 03048867-01 Rectifier bridge 1200 V / 166A 03048868-01 R
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
(auch kein manueller Prozess möglich) PIP Bauteile, die auf der Welle laufen, weil technologisch nicht mit 45°-Rakel gedruckt werden kann Einsparung eines